Third-generation semiconductor power devices are one of the important components of future high-performance power devices. The Hailanjiang R&D team has rich experience in wide-bandgap semiconductor research and has developed a series of SiC MOSFET and GaN HEMT devices. SiC MOSFET features high power density, low reverse recovery charge, and high switching frequency, with an operating temperature up to 200°C, making it a perfect replacement for Si IGBT in high-voltage and high-power applications.